Part 6/9:
The problem posed by this geopolitical maneuvering extends into the realm of semiconductor manufacturing technology itself. TSMC's decision sets a threshold at the 7nm node, delineating a boundary between traditional techniques and the emerging extreme ultraviolet (EUV) lithography, which offers a more advanced method for producing semiconductors.
To understand the implications better, it is crucial to differentiate between deep ultraviolet (DUV) and EUV technologies. DUV is limited in its precision, struggling to achieve the required atomic specificity necessary for modern advanced chips. In contrast, EUV can approach atomic levels, enabling the creation of chips at smaller nodes with higher efficiency and uniformity.