Advantages of CoWoS
The CoWoS technology offers several advantages over traditional packaging methods, including:
- Increased density: CoWoS allows for the creation of high-density packages that can contain multiple chips.
- Improved performance: By integrating multiple chips onto a single substrate, CoWoS enables the creation of high-performance computing and AI components.
- Reduced power consumption: CoWoS packages can be designed to reduce power consumption, which is critical for applications that require low power consumption.
- Increased reliability: CoWoS packages can be designed to be more reliable than traditional packages, which can improve overall system reliability.