RE: LeoThread 2024-09-01 09:25

[taskmaster4450le]

1. Customer acquisition:
   • Intel is actively courting major customers. They've already announced partnerships with companies like Qualcomm and Amazon.

1. Packaging innovations:
   • Intel is emphasizing advanced packaging technologies like their Foveros 3D stacking, which could be a differentiator.

1. Focus on leading-edge and mature nodes:
   • While pushing for advanced nodes, Intel is also maintaining capacity for mature nodes, which are still in high demand for many applications.