TSMC's CoWoS expansion plans
As mentioned earlier, TSMC has announced plans to expand its CoWoS capabilities in response to growing demand for high-performance computing and AI components. The company's expansion plans include:
- Doubling production capacity: TSMC plans to double its production capacity for CoWoS packaging technology year-over-year in both 2024 and 2025.
- Increasing capacity: TSMC expects its monthly packaging volume to reach around 35,000 to 40,000 wafers by the end of 2024 and a further surge to roughly 80,000 wafers in 2025.
- Switching to rectangular substrates: TSMC plans to switch from conventional round wafers to rectangular substrates to increase the number of chips that can be placed on each wafer.
- Investing in new equipment: TSMC is investing in new equipment, including wet process equipment, to support its CoWoS expansion plans.