The CoWoS technology involves several key components:
- Wafer: A silicon wafer is used as the substrate for the package.
- Chips: Multiple chips are mounted onto the wafer, which can include CPUs, GPUs, and other semiconductor devices.
- Packaging material: A material, such as plastic or ceramic, is used to encapsulate the chips and wafer.
- Interface: The package includes interfaces, such as connectors and pads, that allow the package to be connected to other components.